Match-making for Monolithic 3D IC: Finding the Right Technology Node

被引：18

作者：

Chang, Kyungwook ^{[1
]}

Sinha, Saurabh ^{[2
]}

Cline, Brian ^{[2
]}

Yeric, Greg ^{[2
]}

Lim, Sung Kyu ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch ECE, Atlanta, GA 30332 USA

[2] ARM Inc, Austin, TX USA

来源：

2016 ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC) | 2016年

关键词：

D O I：

10.1145/2897937.2898043

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Monolithic 3D IC (M3D) has the potential to provide a break-through in the power and performance scaling challenges. We, for the first time, present a comprehensive study of M3D on a commercial design across multiple technology nodes. The performance and power impact of M3D is investigated using a commercial, in-order, 32-bit application processor, implemented on foundry 28nm and 14/16nm process nodes, as well as a predictive 7nm node. We study the factors across the technology nodes that affect the efficiency of M3D, and propose a roadmap for optimum technology and design interaction that will enable the full entitlement of M3D.

引用

页数：6