Silicon Microfabrication Processes Including Anodic Bonding of Extremely Thin (60 μm -Thick) Silicon on Glass

A new silicon MEMS process has been proposed utilizing anodic bonding of an extremely thin silicon film (60 mu m) on a glass substrate, followed by photo lithographically defining micro spring structures on the silicon film and dry etching the silicon film using an inductively coupled plasma (ICP) dry etcher. After that, the underneath glass was selectively etched off using a hydrofluoric (HF) solution to release the micro spring. This technique was successfully applied to a micro vibration detection sensor with the silicon microspring with a cross section of 10 mu m x 60 mu m with a length longer than 500 mu m.