Flexible Printed Circuit Meshed Ground Plane Modeling Methodology

被引:0
|
作者
Sreerama, Chaitanya [1 ]
Hall, Stephen H. [1 ]
Gantner, Eric [1 ]
机构
[1] Intel Corp, Client Comp Grp, Hillsboro, OR 97124 USA
来源
2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI) | 2017年
关键词
Flexible Printed Circuits; Meshed ground plane;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Flexible Printed Circuits (FPC's) are widely used inside electronic devices because they are easy to customize, enable relatively dense interconnect routing, and are the most physically flexible. Physical flexibility can be further enhanced by using a meshed ground/reference plane. Unfortunately, meshed ground planes can induce significant signal integrity problems that can roadblock high-speed channel design if not properly modeled. This introduces unique modeling challenges that commercially available software are ill equipped to solve. This paper presents a new simulation methodology to model FPC meshed ground planes in high-performance compute systems using existing quasi-TEM solvers with excellent measurement correlation.
引用
收藏
页数:4
相关论文
共 50 条
  • [31] Suppression effect by conducting plate under ground plane for emission from printed circuit board
    Tobana, T
    Sasamori, T
    Abe, K
    IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (01): : 38 - 43
  • [32] Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology
    Leong, W. C.
    Abdullah, M. Z.
    Khor, C. Y.
    MICROELECTRONICS RELIABILITY, 2013, 53 (12) : 1996 - 2004
  • [33] Analytical investigation of resonant frequency of a microstrip antenna with meshed ground plane
    Takahashi, T
    Chiba, I
    IEICE TRANSACTIONS ON ELECTRONICS, 2000, E83C (05): : 755 - 758
  • [34] Extracting Characteristic Impedance of a Transmission Line Referenced to a Meshed Ground Plane
    He, Jiayi
    Hwang, Chulsoon
    Pan, Jingnan
    Cho, Gyu-Yeong
    Bae, Bumhee
    Park, Hark-Byeong
    Fan, Jun
    2016 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2016, : 651 - 656
  • [35] Analytical investigation of resonant frequency of a microstrip antenna with meshed ground plane
    Takahashl, Tor U.
    Criba, Isamu
    IEICE Transactions on Electronics, 2000, E83-C (05) : 755 - 758
  • [36] Electromagnetic interference from printed circuit boards connected by flexible printed circuit board
    Ota, Masayuki
    Sakusabe, Takashi
    Takahashi, Takehiro
    Schibuya, Noboru
    2008 ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 19TH INTERNATIONAL ZURICH SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, 2008, : 654 - +
  • [37] Electromagnetic behaviour of flexible substrates with meshed and conductive films ground planes
    Rotaru, Mihai D.
    Pu, S. H.
    Kumar, A.
    Mok, C. W.
    2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE, 2016,
  • [38] Estimation of printed circuit board ground plane net partial inductance via noise voltage measurements
    Leferink, FBJ
    van Etten, WC
    2003 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD, VOLS 1 AND 2, 2003, : 242 - 247
  • [40] Hard and flexible optical printed circuit board
    Lee, El-Hang
    Lee, Hyun Sik
    Lee, S. G.
    O, B. H.
    Park, S. G.
    Kim, K. H.
    ORGANIC PHOTONIC MATERIALS AND DEVICES IX, 2007, 6470