Flexible Printed Circuit Meshed Ground Plane Modeling Methodology

被引:0
|
作者
Sreerama, Chaitanya [1 ]
Hall, Stephen H. [1 ]
Gantner, Eric [1 ]
机构
[1] Intel Corp, Client Comp Grp, Hillsboro, OR 97124 USA
来源
2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI) | 2017年
关键词
Flexible Printed Circuits; Meshed ground plane;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Flexible Printed Circuits (FPC's) are widely used inside electronic devices because they are easy to customize, enable relatively dense interconnect routing, and are the most physically flexible. Physical flexibility can be further enhanced by using a meshed ground/reference plane. Unfortunately, meshed ground planes can induce significant signal integrity problems that can roadblock high-speed channel design if not properly modeled. This introduces unique modeling challenges that commercially available software are ill equipped to solve. This paper presents a new simulation methodology to model FPC meshed ground planes in high-performance compute systems using existing quasi-TEM solvers with excellent measurement correlation.
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页数:4
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