Improved Design and Microfabrication of H-Plane and E-Plane Loaded Rectangular Slow-Wave Structure for THz TWT Amplifier

被引:10
作者
Billa, Laxma Reddy [1 ]
Shi, Xianbao [2 ]
Akram, Muhammad Nadeem [1 ]
Chen, Xuyuan [1 ]
机构
[1] Univ Coll Southeast Norway, Dept Micro & Nanosyst Technol, N-3184 Borre, Norway
[2] Univ Elect Sci & Technol China, Sch Phys Elect, Vacuum Elect Natl Lab, Chengdu 610054, Peoples R China
基金
美国国家科学基金会;
关键词
Phase velocity matching; slow-wave structure (SWS); terahertz (THz) amplifier; traveling-wave tube (TWT); vacuum electronics; TERAHERTZ TECHNOLOGY; HIGH-POWER; G-BAND; GUIDE;
D O I
10.1109/TED.2017.2683399
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports further investigation on a recently proposed H-plane and E-plane loaded slow-wave structure (SWS) for terahertz traveling-wave tube (TWT) amplifier. An improved input-output coupler is designed to enable easy fabrication by microfabrication technology, UV-lithography, electroplating, and molding (LIGA), and deep reactive-ion etching. The coupler shows very low reflection coefficient, S-11 < - 15 dB over a frequency range 360-450 GHz. To improve the beam-wave interaction and enhance the saturated output power of the TWT, the SWS with tapered design is implemented. By tuning the period, the wave is resynchronized with the beam at the end of the SWS, resulting in more than 60% increase in the saturated output power across the 80-GHz bandwidth. In addition, the sensitivity of the output power of the TWT to the fabrication tolerance of the individual geometrical parameters is also studied in detail. It is found that the output power reduces by 80% for approximately 2% variation in the synchronized beam voltage. The KMPR-based UV-LIGA technique is adopted to fabricate the H-plane and E-plane loaded SWS. The measured lateral dimensional accuracy within similar to 2 mu m and rms roughness of metal sidewall surface less than 80 nm is obtained.
引用
收藏
页码:2383 / 2389
页数:7
相关论文
共 21 条
[1]  
Basten M. A., 2012, 2012 IEEE Thirteenth International Vacuum Electronics Conference and the ninth International Vacuum Electron Sources Conference (IVEC-IVESC 2012), P39, DOI 10.1109/IVEC.2012.6262066
[2]   Observation of Hydrofluoric Acid Burns on Osseous Tissues by Means of Terahertz Spectroscopic Imaging [J].
Baughman, William E. ;
Yokus, Hamdullah ;
Balci, Soner ;
Wilbert, David Shawn ;
Kung, Patrick ;
Kim, Seongsin Margaret .
IEEE JOURNAL OF BIOMEDICAL AND HEALTH INFORMATICS, 2013, 17 (04) :798-805
[3]   H-Plane and E-Plane Loaded Rectangular Slow-Wave Structure for Terahertz TWT Amplifier [J].
Billa, Laxma Reddy ;
Akram, Muhammad Nadeem ;
Chen, Xuyuan .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (04) :1722-1727
[4]   Vacuum Electronic High Power Terahertz Sources [J].
Booske, John H. ;
Dobbs, Richard J. ;
Joye, Colin D. ;
Kory, Carol L. ;
Neil, George R. ;
Park, Gun-Sik ;
Park, Jaehun ;
Temkin, Richard J. .
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2011, 1 (01) :54-75
[5]   Plasma physics and related challenges of millimeter-wave-to-terahertz and high power microwave generation [J].
Booske, John H. .
PHYSICS OF PLASMAS, 2008, 15 (05)
[6]   Review of terahertz and subterahertz wireless communications [J].
Federici, John ;
Moeller, Lothar .
JOURNAL OF APPLIED PHYSICS, 2010, 107 (11)
[7]   Materials for terahertz science and technology [J].
Ferguson, B ;
Zhang, XC .
NATURE MATERIALS, 2002, 1 (01) :26-33
[8]   Microfabrication of high-frequency vacuum electron devices [J].
Ives, RL .
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2004, 32 (03) :1277-1291
[9]   Demonstration of a High Power, Wideband 220-GHz Traveling Wave Amplifier Fabricated by UV-LIGA [J].
Joye, Colin D. ;
Cook, Alan M. ;
Calame, Jeffrey P. ;
Abe, David K. ;
Vlasov, Alexander N. ;
Chernyavskiy, Igor A. ;
Nguyen, Khanh T. ;
Wright, Edward L. ;
Pershing, Dean E. ;
Kimura, Takuji ;
Hyttinen, Mark ;
Levush, Baruch .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (06) :1672-1678
[10]   High-Power Copper Gratings for a Sheet-Beam Traveling-Wave Amplifier at G-band [J].
Joye, Colin D. ;
Calame, Jeffrey P. ;
Cook, Alan M. ;
Garven, Morag .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (01) :506-509