Transmission electron microscopy of joints between the Sn-Ag solder and the electroless Ni-P of an electronic device

被引：3
|
作者：
Torazawa, N [1 ]
Arai, S
Shimoyama, K
Takase, Y
Saka, H
机构：
[1] Nagoya Univ, Dept Quantum Engn, Nagoya, Aichi 4648603, Japan
[2] Nagoya Univ, Ctr Intrgrated Res Sci & Technol, Nagoya, Aichi 4648603, Japan
[3] Matsushita Eelct Components Co Ltd, Corp Components Dev Ctr, Osaka 5718506, Japan
来源：
JOURNAL OF THE JAPAN INSTITUTE OF METALS | 2002年 / 66卷 / 02期
关键词：
lead-free solder; nickel-phosphorus; transmission electron microscopy; semiconductor package; focused-ion beam; Kirkendall void; strength;
D O I：
10.2320/jinstmet1952.66.2_47
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Microstructure of Pb-free Sn-Ag solder and joints between the Pb-free solders and electroless Ni-P was examined by means of transmission electron microscopy. Microstructures of the solders consist of beta-Sn matrix dispersed with Ag3Sn particles. Analysis of the diffraction patterns shows that there are more than one orientation relationships between,beta-Sn and Ag3Sn. The solder joint of the Pb-free solders is essentially similar to the joint of Pb-Sn eutectic solders. Analysis of distribution of the elements by EDX analysis shows that Ag does not diffuse into Ni-P. Both of the as-deposited Ni-P and P-enriched Ni, the latter being formed as a result of reaction with Sn-Ag solder, have FCC structures based on pure Ni. In other words, P is dissolved in Ni to form a solid solution.
引用
收藏
页码：47 / 52
页数：6
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