The Effects of Cold Arm Width and Metal Deposition on the Performance of a U-Beam Electrothermal MEMS Microgripper for Biomedical Applications

被引:25
作者
Cauchi, Marija [1 ]
Grech, Ivan [2 ]
Mallia, Bertram [3 ]
Mollicone, Pierluigi [1 ]
Sammut, Nicholas [2 ]
机构
[1] Univ Malta, Dept Mech Engn, Fac Engn, MSD-2080 Msida, Malta
[2] Univ Malta, Fac Informat & Commun Technol, Dept Microelect & Nanoelect, MSD-2080 Msida, Malta
[3] Univ Malta, Fac Engn, Dept Met & Mat Engn, MSD-2080 Msida, Malta
来源
MICROMACHINES | 2019年 / 10卷 / 03期
关键词
microelectromechanical systems (MEMS); microgrippers; electrothermal actuation; red blood cells; micromanipulation; SOIMUMPs (TM); single crystal silicon; cold arm width; metal deposition; DESIGN;
D O I
10.3390/mi10030167
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Microelectromechanical systems (MEMS) have established themselves within various fields dominated by high-precision micromanipulation, with the most distinguished sectors being the microassembly, micromanufacturing and biomedical ones. This paper presents a horizontal electrothermally actuated 'hot and cold arm' microgripper design to be used for the deformability study of human red blood cells (RBCs). In this study, the width and layer composition of the cold arm are varied to investigate the effects of dimensional and material variation of the cold arm on the resulting temperature distribution, and ultimately on the achieved lateral displacement at the microgripper arm tips. The cold arm widths investigated are 14 mu m, 30 mu m, 55 mu m, 70 mu m and 100 mu m. A gold layer with a thin chromium adhesion promoter layer is deposited on the top surface of each of these cold arms to study its effect on the performance of the microgripper. The resultant ten microgripper design variants are fabricated using a commercially available MEMS fabrication technology known as a silicon-on-insulator multi-user MEMS process (SOIMUMPs)(TM). This process results in an overhanging 25 mu m thick single crystal silicon microgripper structure having a low aspect ratio (width:thickness) value compared to surface micromachined structures where structural thicknesses are of the order of 2 mu m. Finite element analysis was used to numerically model the microgripper structures and coupled electrothermomechanical simulations were implemented in CoventorWare (R). The numerical simulations took into account the temperature dependency of the coefficient of thermal expansion, the thermal conductivity and the electrical conductivity properties in order to achieve more reliable results. The fabricated microgrippers were actuated under atmospheric pressure and the experimental results achieved through optical microscopy studies conformed with those predicted by the numerical models. The gap opening and the temperature rise at the cell gripping zone were also compared for the different microgripper structures in this work, with the aim of identifying an optimal microgripper design for the deformability characterisation of RBCs.
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页数:18
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