YBCO coated conductor by multiple-stage CVD

被引:6
作者
Kashima, N [1 ]
Niwa, T
Mori, M
Nagaya, S
Muroga, T
Miyata, S
Watanabe, T
Yamada, Y
Izumi, T
Shiohara, Y
机构
[1] Chubu Elect Power Co Inc, Midori Ku, Nagoya, Aichi 4598522, Japan
[2] ISTEC, SRL, Atsuta Ku, Nagoya, Aichi 4568567, Japan
[3] ISTEC, SRL, Koto Ku, Tokyo 1350062, Japan
来源
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS | 2005年 / 426卷 / II期
关键词
coated conductor; YBCO; CVD; MO-CVD; multi-stage CVD system; long YBCO tape; IBAD;
D O I
10.1016/j.physc.2005.01.055
中图分类号
O59 [应用物理学];
学科分类号
摘要
A high speed deposition technique for YBCO coated conductors has been required from the viewpoint of cost reduction for second generation wire. The multiple-stage chemical vapor deposition technique was employed for making YBCO coated conductors with a high deposition rate. In our earlier research, over 2.0 MA/cm(2) of J(c) was confirmed on MAD (PLD-CeO2/IBAD-Gd2Zr2O7/Hastelloy) substrates with a maximum deposition rate of 25 m/h using the six-stage CVD system. To evaluate the availability of the multiple-stage CVD technique for making a longer YBCO tape, we have fabricated a 200 m-long YBCO tape on a non-textured silver substrate. Deposition rate was 10 m/h, and number of passing was two times. Total deposition time was 40 h (20 h x 2). During the deposition of a YBCO layer, the CVD system was quite stable. J(c) was measured at a voltage tap interval of 10 in with criterion of 1 mu V/cm. J(c) of the YBCO tape remained in the order of 10(4) A/cm(2) due to the non-textured microstructure. However, J(c) distribution of the tape showed a good uniformity. A 2 10 m-long YBCO/(Ag +BAD) tape was also prepared. A 210 m-long substrate combined with MAD and Ag was used. I-c of 60-78 A was obtained on the IBAD substrates part. This result suggested that the multiple-stage CVD technique was very useful to making a long YBCO tape. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:887 / 892
页数:6
相关论文
共 13 条
[1]   {110} ⟨110⟩ textured Ag tapes for biaxially oriented YBa2Cu3O7 coated conductors [J].
Doi, T ;
Inoue, K ;
Hakuraku, Y ;
Onabe, K ;
Okada, M ;
Kashima, N ;
Nagaya, S .
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2003, 392 :853-858
[2]   High critical current density superconducting tapes by epitaxial deposition of YBa2Cu3Ox thick films on biaxially textured metals [J].
Goyal, A ;
Norton, DP ;
Budai, JD ;
Paranthaman, M ;
Specht, ED ;
Kroeger, DM ;
Christen, DK ;
He, Q ;
Saffian, B ;
List, FA ;
Lee, DF ;
Martin, PM ;
Klabunde, CE ;
Hartfield, E ;
Sikka, VK .
APPLIED PHYSICS LETTERS, 1996, 69 (12) :1795-1797
[3]   Biaxially aligned YBCO film tapes fabricated by all pulsed laser deposition [J].
Hasegawa, K ;
Fujino, K ;
Mukai, H ;
Konishi, M ;
Hayashi, K ;
Sato, K ;
Honjo, S ;
Sato, Y ;
Ishii, H ;
Iwata, Y .
APPLIED SUPERCONDUCTIVITY, 1996, 4 (10-11) :487-493
[4]   INPLANE ALIGNED YBA2CU3O7-X THIN-FILMS DEPOSITED ON POLYCRYSTALLINE METALLIC SUBSTRATES [J].
IIJIMA, Y ;
TANABE, N ;
KOHNO, O ;
IKENO, Y .
APPLIED PHYSICS LETTERS, 1992, 60 (06) :769-771
[5]   Long tape processing for coated conductors by multiple-stage CVD method [J].
Kashima, N ;
Niwa, T ;
Nagaya, S ;
Onabe, K ;
Saito, T ;
Muroga, T ;
Miyata, S ;
Watanabe, T ;
Yamada, Y .
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2004, 412 :944-947
[6]  
KASHIMA N, IN PRESS IEEE T APPL
[7]   Fabrication of in-plane aligned YBCO films on polycrystalline Ni tapes buffered with surface-oxidized NiO layers [J].
Matsumoto, K ;
Kim, SB ;
Wen, JG ;
Hirabayashi, I ;
Watanabe, T ;
Uno, N ;
Ikeda, M .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 1999, 9 (02) :1539-1542
[8]   Rapid formation of long Y1Ba2Cu3Ox superconducting tape by chemical vapor deposition technique [J].
Onabe, K ;
Doi, T ;
Kashima, N ;
Nagaya, S ;
Saitoh, T .
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2003, 392 :863-866
[9]   Superconducting property of Y1Ba2Cu3Ox films formed on silver substrates by continuous chemical vapor deposition technique [J].
Onabe, K ;
Akata, H ;
Higashiyama, K ;
Nagaya, S ;
Saitoh, T .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2001, 11 (01) :3150-3153
[10]  
SHIKIMACHI K, IN PRESS IEEE T APPL