Design of 3.3V Rail To Rail Operational Amplifier for High Resolution ADC Driver Amplifier

被引：0

作者：

Sheeparamatti, Arshath ^{[1
]}

Bhat, M. Vineeth ^{[1
]}

Srivatsa, M. P. ^{[1
]}

Nithin, M. ^{[1
]}

机构：

[1] RV Coll Engn, Dept Elect & Commun Engn, Bengaluru 560059, India

来源：

2017 INTERNATIONAL CONFERENCE ON INNOVATIVE MECHANISMS FOR INDUSTRY APPLICATIONS (ICIMIA) | 2017年

关键词：

opamp; rail to rail swing;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The design and analysis of a two stage high swing operational amplifier commonly known as rail to rail opamp with 3.3V supply voltage used in high resolution ADC driver amplifier is discussed in this paper. The design uses 0.35 mu m CMOS technology with a differential stage for input and a common source stage (CS) as the second stage with output being single ended. The compensation technique used is Miller compensation which is in the form of a capacitor between the differential and CS stage. The open loop gain of the design is 89.87 dB and the achieved voltage swing is 82.42% of the supply rail.

引用

页码：317 / 321

页数：5

共 14 条

[1]

[Anonymous], 4 IEEE INT S EL DES

[2]

Arbet D, 2012, APPLIED ELECTRONICS, P17

[3] A HIGH-PERFORMANCE LOW-POWER CMOS CHANNEL FILTER [J].

BLACK, WC ;

ALLSTOT, DJ ;

REED, RA .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1980, 15 (06) :929-938

[4] 1-V Low-Power Programmable Rail-to-Rail Operational Amplifier With Improved Transconductance Feedback Technique [J].

Dai, Shanshan ;

Cao, Xiaofei ;

Yi, Ting ;

Hubbard, Allyn E. ;

Hong, Zhiliang .

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2013, 21 (10) :1928-1935

[5]

Dendouga A., 2015, 10 INT C DES TECHN I, P1

[6] A high-swing CMOS telescopic operational amplifier [J].

Gulati, K ;

Lee, HS .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1998, 33 (12) :2010-2019

[7] LOW-POWER LOW-VOLTAGE VLSI OPERATIONAL-AMPLIFIER CELLS [J].

HUIJSING, JH ;

HOGERVORST, R ;

DELANGEN, KJ .

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 1995, 42 (11) :841-852

[8]

Khare K., 2008, International Conference on Electronic Design, P1, DOI [10.1109/ICED.2008.4786640, DOI 10.1109/ICED.2008.4786640]

[9]

Lee EKF, 2012, IEEE INT SYMP CIRC S, P197, DOI 10.1109/ISCAS.2012.6271662

[10]

Lorenzo M. G., 2007, INT S COMM INF TECHN, P61

← 1 2 →