Epoxy resin (EP)/nano-SiO2 composite material preparation by two processes

被引:1
作者
Zhao, Yingna [1 ]
Zeng, Xiongfeng [1 ]
Zhang, Wenli [1 ]
机构
[1] Hebei United Univ, Sch Mat Sci & Engn, Tangshan 063000, Hebei, Peoples R China
来源
ADVANCES IN MATERIALS AND MATERIALS PROCESSING, PTS 1-3 | 2013年 / 652-654卷
关键词
Epoxy resin; Nano-SiO2; Ultrasonic wave (UW); Sol-gel (SG); PARTICLES; SYSTEM;
D O I
10.4028/www.scientific.net/AMR.652-654.127
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Ultrasonic wave (UW) and sol-gel (SG) technology were using to preprocess the nano-SiO2, and the SiO2/EP composites were prepared by adding coupling agent KH-550, curing agent T-31 and different contents SiO2 into EP matrix. Using infrared spectra analysis tested the samples' structures and the thermal stability of two preparation processes were tested by TG. The results indicated that, the thermal stability of the SiO2/EP composites by UW preprocess was improved about 25 degrees C -60 degrees C when compared with pure EP and the SiO2/EP composites by SG. Comparing to the comprehensive evaluation of thermal stability of different SiO2 contents SiO2/EP composites, the most optimum additive of nano-SiO2 was about 10 wt. % by UW process.
引用
收藏
页码:127 / 130
页数:4
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