Reliability study of carbon-doped GST stack robust against Pb-free soldering reflow

被引:0
作者
Souiki, S. [1 ,2 ]
Hubert, Q. [1 ,2 ]
Navarro, G. [1 ]
Persico, A. [1 ]
Jahan, C. [1 ]
Henaff, E. [1 ]
Delaye, V. [1 ]
Blachier, D. [1 ]
Sousa, V. [1 ]
Perniola, L. [1 ]
Vianello, E.
De Salvo, B. [1 ]
机构
[1] CEA LETI Minatec, 17 Rue Martyrs, F-38054 Grenoble, France
[2] IMEP LAHC, F-38016 Grenoble 1, France
来源
2013 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2013年
关键词
reliability; phase change memory; Carbon-doped GST; soldering issue;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we investigate the performances of carbon-doped Ge2Sb2Te5 films (named hereafter GST) which have been integrated together with a thin titanium capping layer into Phase-Change Memory devices. We show that the carbon content into GST and the titanium cap layer thickness can be optimized to obtain an Amorphous As-Deposited (AAD) phase which is stable under both the typical Back End-Of-Line (BEOL) thermal budget ( 2 min at 400 degrees C) and standard Pb-free soldering reflow process conditions (temperature peak at 260 degrees C). Therefore, the material obtained at fab-out keeps its disordered phase and can be used to pre-code one state of information stable against the standard soldering reflow ( peak at 260 C). We propose to use this high resistance state together with an electrically induced low resistance state to pre-code the memory prior to PCB manufacturing.
引用
收藏
页数:5
相关论文
共 5 条
[1]   Ti diffusion in chalcogenides: a ToF-SIMS depth profile characterization approach [J].
Alberici, SG ;
Zonca, R ;
Pashmakov, B .
APPLIED SURFACE SCIENCE, 2004, 231 :821-825
[2]   Irreversible modification of Ge2Sb2Te5 phase change material by nanometer-thin Ti adhesion layers in a device-compatible stack [J].
Cabral, C., Jr. ;
Chen, K. N. ;
Krusin-Elbaum, L. ;
Deline, V. .
APPLIED PHYSICS LETTERS, 2007, 90 (05)
[3]  
Hubert Q., IMW 2012
[4]   GeTe phase change material and Ti based electrode: Study of thermal stability and adhesion [J].
Loubriat, S. ;
Muyard, D. ;
Fillot, F. ;
Roule, A. ;
Veillerot, M. ;
Barnes, J. P. ;
Gergaud, P. ;
Vandroux, L. ;
Verdier, M. ;
Maitrejean, S. .
MICROELECTRONIC ENGINEERING, 2011, 88 (05) :817-821
[5]  
Philip Wong H.-S., 00189219 IEEE