A 4.7-Gb/s Imaging Receiver with Adaptive Spectrum Re-Balancing Equalizer for Wireless Optical Communications
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作者:
Nakhkoob, Behrooz
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机构:
Rensselaer Polytech Inst, ECSE Dept, Troy, NY 12180 USARensselaer Polytech Inst, ECSE Dept, Troy, NY 12180 USA
Nakhkoob, Behrooz
[1
]
Hella, Mona M.
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机构:
Rensselaer Polytech Inst, ECSE Dept, Troy, NY 12180 USARensselaer Polytech Inst, ECSE Dept, Troy, NY 12180 USA
Hella, Mona M.
[1
]
机构:
[1] Rensselaer Polytech Inst, ECSE Dept, Troy, NY 12180 USA
来源:
2014 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM
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2014年
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D O I:
暂无
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Imaging Optical Receivers (IOR), in which a single photodiode (PD) is replaced by an array of small on chip PDs followed by a matrix of switches, can reduce the received ambient light noise, multi-path distortion, and allow electronic Line Of Sight (LOS) detection and tracking of the transmitted signal. However, such receivers experience a change in the total input capacitance introduced to the front-end circuitry depending on the number of activated PDs in LOS with the transmitter, mandating adaptive equalization in the receive side. In this work, a high speed imaging receiver is reported in IBM 130 nm CMOS technology. The receiver is formed of a 3 x 3 matrix of high speed Spatially Modulated Light detectors (SML) followed by a trans-impedance amplifier, an adaptive equalizer and a limiting amplifier. For one activated PD, the chip is capable of communicating at speeds up to 4.7-Gb/s with BER = 10(-10) and sensitivity of -3.5 dBm using lambda = 850 nm modulated light. For 9 activated PDs, corresponding to an input capacitance of 11.5 pF, the chip is capable of communicating at speeds up to 2-Gb/s for BER = 10(-12) and an optical sensitivity of -5 dBm. The power consumption of the imaging receiver is 97 mW from a single 1.5 V dc supply and the total die area is 1400 mu m x 870 mu m.
机构:
Hong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R China
eTopus Technol Inc, Sunnyvale, CA 94085 USAHong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R China
Pan, Quan
Wang, Yipeng
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机构:
Hong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R China
Wang, Yipeng
Lu, Yan
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机构:
Hong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R China
Univ Macau, State Key Lab Analog & Mixed Signal VLSI, Zhuhai, Guangdong, Peoples R ChinaHong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R China
Lu, Yan
Yue, C. Patrick
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机构:
Hong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Elect & Comp Engn Dept, Hong Kong, Hong Kong, Peoples R China
机构:
Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Chen, Wenya
Cai, Qingsong
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机构:
Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Cai, Qingsong
Yang, Zhong
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机构:
Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Yang, Zhong
Qiao, Shushan
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机构:
Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
Univ Chinese Acad Sci, Beijing 100049, Peoples R ChinaChinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China