Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Composites

被引:5
作者
Carneiro, V. H. [1 ]
Capela, P. [1 ]
Teixeira, J. C. [1 ]
Teixeira, S. [2 ]
Cerqueira, F. [3 ]
Macedo, F. [3 ]
Ribas, L. [4 ]
Soares, D. [1 ]
机构
[1] Univ Minho, Dept Mech Engn, Campus Azurem, P-4800058 Guimaraes, Portugal
[2] Univ Minho, Dept Prod & Syst Engn, Campus Azurem, P-4800058 Guimaraes, Portugal
[3] Univ Minho, Phys Ctr, Campus Azurem, P-4800058 Guimaraes, Portugal
[4] Bosch Car Multimedia, Braga, Portugal
关键词
DMA; Composite materials; Elastic properties; Electronic materials; Viscoelasticity; EPOXY;
D O I
10.1007/s10443-016-9510-7
中图分类号
TB33 [复合材料];
学科分类号
摘要
The impact in the elastic behavior and internal friction, caused by the introduction of Copper layers in Glass-Fiber/Epoxy Resin composites and temperature effects, were studied and evaluated recurring to Dynamic Mechanical Analysis. It is shown that the introduction of Copper layers increases the storage modulus of the composites and delays their glass transition temperature, however, it allows a faster transformation. Additionally, it is concluded that the introduction of Copper layers elevates the internal friction during the glass transition phase by the inversion of the deformation mechanism due to thermal expansion and increase in the Poisson's ratio of the epoxy resin to a value near 0.5 where its deformation is approximately isochoric. This increase in damping capacity is relevant in application with cyclic fatigue and mechanical vibration.
引用
收藏
页码:1219 / 1228
页数:10
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