Low-Crosstalk Simultaneous 16-Channel x 25 Gb/s Operation of High-Density Silicon Photonics Optical Transceiver

被引:39
作者
Aoki, Tsuyoshi [1 ,2 ]
Sekiguchi, Shigeaki [1 ,2 ]
Simoyama, Takasi [1 ,2 ]
Tanaka, Shinsuke [1 ,2 ]
Nishizawa, Motoyuki [1 ,2 ]
Hatori, Nobuaki [1 ,2 ]
Sobu, Yohei [1 ,2 ]
Sugama, Akio [3 ]
Akiyama, Tomoyuki [1 ,2 ]
Hayakawa, Akinori [1 ,2 ]
Muranaka, Hidenobu [3 ]
Mori, Toshihiko [1 ,2 ]
Chen, Yanfei [4 ]
Jeong, Seok-Hwan [1 ,2 ]
Tanaka, Yu [1 ,2 ]
Morito, Ken [1 ,2 ]
机构
[1] Photon Elect Technol Res Assoc, Tsukuba, Ibaraki 3058569, Japan
[2] Fujitsu Ltd, Kawasaki, Kanagawa 2110053, Japan
[3] Fujitsu Labs Ltd, Atsugi, Kanagawa 2430197, Japan
[4] Fujitsu Labs Ltd, Kawasaki, Kanagawa 2118588, Japan
关键词
Crosstalk; electric integrated circuit; flip chip bonding; package substrate; penalty; photonic integrated circuit; power integrity; receiver; signal integrity; silicon photonics; transceiver; transmitter;
D O I
10.1109/JLT.2018.2797167
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We successfully developed a high-density broadband 16-channel x 25 Gb/s on-package silicon photonics optical transceiver. The flip chip bonded bridge structure realized high density of about 363 Gb/s/cm(2). We demonstrated simultaneously on all 16 channels error-free operations with low crosstalk penalties of Tx-to-Tx 1.4 dB, Rx-to-Rx 1.4 dB, and Tx-to-Rx < 0.1 dB.
引用
收藏
页码:1262 / 1267
页数:6
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