Dry etching of BaSrTiO3 and LaNiO3 thin films in inductively coupled plasmas

被引:7
作者
Lee, KP [1 ]
Jung, KB [1 ]
Srivastava, A [1 ]
Kumar, D [1 ]
Singh, RK [1 ]
Pearton, SJ [1 ]
机构
[1] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
关键词
D O I
10.1149/1.1392549
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
High density plasma etching of (Ba, Sr)TiO3 (BST) and LaNiO3 (LNO) thin films was performed in two different plasma chemistries, Cl-2/Ar and CH4/H-2/Ar. While the latter chemistry produced extremely low etch rates (less than or equal to 100 Angstrom min(-1)) under all con ditions, the Cl-2/Ar produced smooth anisotropic pattern transfer. The etching was still strongly ion-assisted, but maximum removal rates of similar to 900 Angstrom min(-1) for both materials were achieved with selectivities of similar to 16 for BST and similar to 7 for LNO over Si. A single layer of thick (similar to 7 mu m) photoresist is an effective mask under these conditions. (C) 1999 The Electrochemical Society. S0013-4651(99)01-086-1. All rights reserved.
引用
收藏
页码:3778 / 3782
页数:5
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