TEMPORARY WAFER BONDING AND DEBONDING BY AN ELECTROCHEMICALLY ACTIVE POLYMER ADHESIVE FOR 3D INTEGRATION

被引：0

作者：

Gatty, Hithesh K. ^{[1
]}

Niklaus, Frank ^{[1
]}

Stemme, Goran ^{[1
]}

Roxhed, Niclas ^{[1
]}

机构：

[1] KTH Royal Inst Technol, Stockholm, Sweden

来源：

26TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2013) | 2013年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thin wafer handling is an important issue in 3D integration technologies. This paper reports on an efficient method for bonding a thin wafer and debonding it at room temperature from a carrier wafer. This method addresses the major problem of fragility and flexibility in handling of thin wafers used in TSV fabrication. In the presented method the carrier wafer is spin coated with an electrochemically active polymer adhesive. It is then bonded to a device wafer. The wafer stack is thinned and finally released from the carrier wafer by applying a voltage.

引用

页码：381 / 384

页数：4

共 6 条

[1] Electrolytically assisted debonding of adhesives: An experimental investigation [J].