Copper-Based Nanostructured Coatings for Low-Temperature Brazing Applications

被引：17

作者：

Lehmert, Benjamin ^{[2
]}

Janczak-Rusch, Jolanta ^{[1
]}

Pigozzi, Giancarlo ^{[1
]}

Zuraw, Peter ^{[1
,2
]}

La Mattina, Fabio ^{[3
]}

Wojarski, Lukas ^{[2
]}

Tillmann, Wolfgang ^{[2
]}

Jeurgens, Lars P. H. ^{[1
]}

机构：

[1] Empa, Swiss Fed Labs Mat Sci & Technol, Lab Joining Technol & Corros, CH-8600 Dubendorf, Switzerland

[2] Dortmund Univ Technol TU Dortmund, Fac Mech Engn, Inst Mat Engn, D-44227 Dortmund, Germany

[3] Empa, Swiss Fed Labs Mat Sci & Technol, Reliabil Sci & Technol Lab, CH-8600 Dubendorf, Switzerland

来源：

MATERIALS TRANSACTIONS | 2015年 / 56卷 / 07期

关键词：

copper; thin films; multilayer; brazing; pre-melting; interfaces;

D O I：

10.2320/matertrans.MI201419

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This feasibility study demonstrates the possibility to apply nanostructured filler materials for novel low-temperature brazing applications by exploiting the size-dependent melting behavior of metals and alloys when confined to the nano-scale regime. As an example, a copper-based nanostructured brazing filler is presented, which allows metal brazing of coated Ti-6Al-4V components at 750 degrees C, much below the bulk melting point of copper (1083 degrees C). The copper-based nanostructured brazing fillers can be produced in the form of coatings and free-standing brazing foils. The nano-confinement of Cu is abrogated after brazing and, consequently, the brazed joints can be operated well above their reduced brazing temperatures.

引用

页码：1015 / 1018

页数：4

共 10 条

[1] SMALL PARTICLE MELTING OF PURE METALS [J].