Experimental study on brittle-ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain

被引:134
作者
Liang, Zhiqiang [1 ]
Wang, Xibin [1 ]
Wu, Yongbo [2 ]
Xie, Lijing [1 ]
Jiao, Li [1 ]
Zhao, Wenxiang [1 ]
机构
[1] Beijing Inst Technol, Key Lab Fundamental Sci Adv Machining, Beijing 100081, Peoples R China
[2] Akita Prefectural Univ, Dept Machine Intelligence & Syst Engn, Yurihonjo, Akita 0150055, Japan
基金
中国国家自然科学基金;
关键词
Elliptical ultrasonic assisted grinding (EUAG); Grinding; Single abrasive scratching; Sapphire; Ductile-brittle transition; WEAR;
D O I
10.1016/j.ijmachtools.2013.04.004
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study is carried out to investigate the material removal characteristics in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain. The scratching experiments are performed to develop a fundamental understanding of the ductile-brittle transition mechanism during EUAG of monocrystal sapphire. An elliptical ultrasonic vibrator attached with a sapphire substrate was set up on a multi-axis CNC controlled machining center equipped with a single point diamond tool. The vibrator was constructed by bonding a piezoelectric ceramic device (PZT) having two separated electrodes on a metal elastic body, and an elliptical ultrasonic vibration was generated on the end-face of the metal elastic body when two phases of alternating current (AC) voltages with a phase difference are applied to their respective electrodes on PZT. In scratching experiments, the effects of ultrasonic vibration on the critical depth of cut a(c). for the ductile-brittle transition region and the material removal ratio, i.e., the ratio of the removed material volume to the machined groove volume, f(ab), are investigated by the examination of the scratching groove surfaces with SEM and AFM. The obtained results show that the critical depth of cut in EUAG is much larger than that in conventional grinding without vibration (CG), and even the bigger vibration amplitude leads to a greater improvement. Although the values of f(ab) in the ductile-brittle transition region in both EUAG and CG are less than 1, that in EUAG is bigger than that in CG. Furthermore, as the vibration amplitude increases, the value of f(ab) is increased to eventually be close to 1. These show that it is prone to achieve a ductile mode grinding in greater vibration amplitude. It was also found that in the process there are two kinds of material removal modes, i.e., continuous cutting and discontinuous cutting modes, which are determined by the relationship between values of vibration amplitude and depth of cut. This study validates that the elliptical ultrasonic assisted grinding method is highly effective in ductile mode machining of hard and brittle materials. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码:41 / 51
页数:11
相关论文
共 19 条
[1]  
[Anonymous], 2003, J JPN SOC ABRAS TECH
[2]   Ultrasonically assisted turning of aviation materials: simulations and experimental study [J].
Babitsky, VI ;
Mitrofanov, AV ;
Silberschmidt, VV .
ULTRASONICS, 2004, 42 (1-9) :81-86
[3]   Potentials of different process kinematics in micro grinding [J].
Denkena, B ;
Friemuth, T ;
Reichstein, M .
CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2003, 52 (01) :463-466
[4]  
Liang Z., INT J MACHINE TOOLS, V50
[5]  
Liang Z., 2009, P 5 INT C LEAD EDG M, P535
[6]   An investigation on wear mechanism of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire [J].
Liang, Zhiqiang ;
Wang, Xibin ;
Wu, Yongbo ;
Xie, Lijing ;
Liu, Zhibing ;
Zhao, Wenxiang .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2012, 212 (04) :868-876
[7]   Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance [J].
Liu, K ;
Li, XP ;
Rahman, M ;
Liu, XD .
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2004, 24 (5-6) :389-394
[8]  
Marinescu IoanD., 2006, Handbook of Machining with grinding wheel
[9]  
Namba YH, 2002, P JSME C MAN MACH TO, P209
[10]   Controlling stress in sapphire optics [J].
Smith, MB ;
Schmid, K ;
Schmid, F ;
Khattak, CP ;
Lambropoulos, JC .
OPTICAL MANUFACTURING AND TESTING II, 1997, 3134 :284-292