Flow Condensation on Copper-Based Nanotextured Superhydrophobic Surfaces

Superhydrophobic surfaces have shown excellent ability to promote dropwise condensation with high droplet mobility, leading to enhanced surface thermal transport. To date, however, it is unclear how superhydrophobic surfaces would perform under the stringent flow condensation conditions of saturated vapor at high temperature, which can affect superhydrophobicity. Here, we investigate this issue employing "all-copper" superhydrophobic surfaces with controlled nanostructuring for minimal thermal resistance. Flow condensation tests performed with saturated vapor at a high temperature (110 degrees C) showed the condensing drops penetrate the surface texture (i.e., attain the Wenzel state with lower droplet mobility). At the same time, the vapor shear helped ameliorate the mobility and enhanced the thermal transport. At the high end of the examined vapor velocity range, a heat flux of similar to 600 kW m(-2) was measured at 10 K subcooling and 18 m s(-1) vapor velocity. This clearly highlights the excellent potential of a nanostructured superhydrophobic surface in flow condensation applications. The surfaces sustained dropwise condensation and vapor shear for five days, following which mechanical degradation caused a transition to filmwise condensation. Overall, our results underscore the need to investigate superhydrophobic surfaces under stringent and realistic flow condensation conditions before drawing conclusions regarding their performance in practically relevant condensation applications.