Preparation, solubility and thermal behaviour of new bismaleimides containing silicone linkages

被引：0
作者：
Hao, JJ [1 ]
Wang, WY
Jiang, BB
Cai, XX
Jiang, LX
机构：
[1] Sichuan Univ, Dept Polymer Sci & Mat, Chengdu 610065, Peoples R China
[2] Jiangsu Inst Petrochem Technol, Dept Mat Engn, Changzhou 213016, Jiangsu, Peoples R China
来源：
POLYMER INTERNATIONAL | 1999年 / 48卷 / 03期
关键词：
bismaleimide; bismaleimide with silicone linkages; Diels-Alder reaction; preparation; solubility; thermal-oxidative stability;
D O I：
10.1002/(SICI)1097-0126(199903)48:3<235::AID-PI146>3.0.CO;2-0
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
A series of new bismaleimides containing silicone linkages have been prepared via Diels-Alder reaction of bismaleimides containing silicone and bisfurans containing silicone; their molecular structures have been characterized by FTIR, NMR and elemental analysis, The solubility of the prepared bismaleimides was tested in six types of solvent of different boiling point and polarity, and their curing temperatures were determined by DSC, The thermal-oxidative stability of the cured networks was investigated by TGA and their glass transition temperatures were measured by DSC, revealing that the bismaleimides are soluble in low boiling point solvents and their curing temperatures are in the range 206-285 degrees C, The DSC and TGA traces of cured networks show that the glass transition temperatures are in the range 287-331 degrees C and that these resins are stable up to 353-384 degrees C. (C) 1999 Society of Chemical Industry.
引用
收藏
页码：235 / 243
页数：9
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