Deformation mechanism transition caused by strain rate in a pulse electric brush-plated nanocrystalline Cu

被引：25

作者：

Jiang, Zhonghao ^{[1
]}

Zhang, Hanzhuo ^{[1
]}

Gu, Changdong ^{[1
]}

Jiang, Qing ^{[1
]}

Lian, Jianshe ^{[1
]}

机构：

[1] Jilin Univ, Coll Mat Sci & Engn, Key Lab Automobile Mat, Changchun 130025, Peoples R China

来源：

JOURNAL OF APPLIED PHYSICS | 2008年 / 104卷 / 05期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1063/1.2973200

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Bulk nanocrystalline Cu was synthesized by a pulse electric brush-plating technique. A very large strength (at 2% plastic strain) increase from 644 to 1451 MPa was obtained by compression tests at room temperature and strain rates from 1 X 10(-5) to 3 X 10(0) s(-1). A transition in plastic deformation mechanism with strain rate from a combination of the thermally activated grain boundary sliding and the dislocation emission-absorption in grain boundaries to one dominated by the dislocation activity has been revealed by the significant changes in strain rate sensitivity and apparent activation volume with strain rate. (C) 2008 American Institute of Physics.

引用

页数：5

共 35 条

[1] Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins [J].

Asaro, RJ ;

Suresh, S .

ACTA MATERIALIA, 2005, 53 (12) :3369-3382

[2] Ultrahigh strength in nanocrystalline materials under shock loading [J].

Bringa, EM ;

Caro, A ;

Wang, YM ;

Victoria, M ;

McNaney, JM ;

Remington, BA ;

Smith, RF ;

Torralva, BR ;

Van Swygenhoven, H .

SCIENCE, 2005, 309 (5742) :1838-1841

[3] Interface controlled diffusional creep of nanocrystalline pure copper [J].

Cai, B ;

Kong, QP ;

Lu, L ;

Lu, K .

SCRIPTA MATERIALIA, 1999, 41 (07) :755-759

[4] What is behind the inverse Hall-Petch effect in nanocrystalline materials? [J].

Carlton, C. E. ;

Ferreira, P. J. .

ACTA MATERIALIA, 2007, 55 (11) :3749-3756

[5] Differences in deformation processes in nanocrystalline nickel with low- and high-angle boundaries from atomistic simulations [J].

Caturla, MJ ;

Nieh, TG ;

Stolken, JS .

APPLIED PHYSICS LETTERS, 2004, 84 (04) :598-600

[6] Hardness and strain rate sensitivity of nanocrystalline Cu [J].

Chen, J ;

Lu, L ;

Lu, K .

SCRIPTA MATERIALIA, 2006, 54 (11) :1913-1918

[7] Tensile properties of in situ consolidated nanocrystalline Cu [J].

Cheng, S ;

Ma, E ;

Wang, YM ;

Kecskes, LJ ;

Youssef, KM ;

Koch, CC ;

Trociewitz, UP ;

Han, K .

ACTA MATERIALIA, 2005, 53 (05) :1521-1533

[8] Toward a quantitative understanding of mechanical behavior of nanocrystalline metals [J].

Dao, M. ;

Lu, L. ;

Asaro, R. J. ;

De Hosson, J. T. M. ;

Ma, E. .

ACTA MATERIALIA, 2007, 55 (12) :4041-4065

[9] Enhanced tensile ductility in an electrodeposited nanocrystalline Ni [J].

Gu, CD ;

Lian, JS ;

Jiang, ZH ;

Jiang, Q .

SCRIPTA MATERIALIA, 2006, 54 (04) :579-584

[10]

JIANG Z, 2006, APPL PHYS LETT, V88, P598

← 1 2 3 4 →