Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

被引：19
作者：
Herkommer, Dominik [1 ]
Punch, Jeff [1 ]
Reid, Michael [1 ]
机构：
[1] Univ Limerick, CTVR, Stokes Inst, Limerick, Ireland
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2013年 / 3卷 / 02期
基金：
爱尔兰科学基金会;
关键词：
Constitutive modeling; joint-scale; lead-free solder; shear test data; Sn96.5Ag3.0Cu0.5 (SAC305); BEHAVIOR; ALLOYS;
D O I：
10.1109/TCPMT.2012.2227481
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, the creep behavior of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 (SAC305) solder alloy is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs are conducted on joint-scale solder samples under shear. Stress-strain data is reported for constant stress (15-30 MPa) and constant shear strain rate (1E-6-1E-2 s(-1)) tests at temperatures of 20 degrees C, 50 degrees C, 75 degrees C, and 100 degrees C. The quantitative data gained from the tests is used to fit an Anand viscoplastic constitutive model. The quality of the model fit and the intrinsic variability of the test specimens are also assessed.
引用
收藏
页码：275 / 281
页数：7
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