共 13 条
[2]
Flip chip underfill flow characteristics and prediction
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2000, 23 (03)
:420-427
[3]
GUO Y, 1999, P ELECT COMP TECHNOL, V71
[6]
Underflow process for direct-chip-attachment packaging
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A,
1998, 21 (02)
:266-274
[8]
Marmur A, 1992, Modern Approach to Wettability: Theory and Applications