Novel wire bond material for advanced power module packages

被引：27

作者：

Schmidt, R. ^{[1
]}

Koenig, C. ^{[1
]}

Prenosil, P. ^{[2
]}

机构：

[1] Semikron Elekt GmbH & Co KG, D-90431 Nurnberg, Germany

[2] Heraeus Mat Technol GmbH & Co KG, D-63450 Hanau, Germany

来源：

MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 9-10期

关键词：

Electronics packaging;

D O I：

10.1016/j.microrel.2012.06.139

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Novel heavy wire bonds made of an Al and Cu composite material are introduced. Besides the excellent mechanical and electrical properties an Al-clad Cu wire bond (Al/Cu) provides outstanding stability under cyclic load. To evaluate the potential of the novel material two different types of Al/Cu wires were investigated with respect to processability, ampacity and power cycling capability. In contrast to other advanced wire bond materials no change in the metallization of the chip surface is necessary to establish a stable bonding process. (C) 2012 Elsevier Ltd. All rights reserved.

引用

页码：2283 / 2288

页数：6