Effect of Preheat Treatment on Wear and Corrosion Rates of Copper Electrodeposition on Medium-Carbon Steel

被引:1
作者
Oloruntoba, D. T. [1 ]
Adesina, O. S. [2 ,3 ]
Falana, O. [1 ]
Akinluwade, K. J. [4 ]
机构
[1] Fed Univ Technol Akure, Dept Met & Mat Engn, PMB 704, Akure, Ondo State, Nigeria
[2] Tshwane Univ Technol, Dept Chem & Met Engn, PMB X680, ZA-0001 Pretoria, South Africa
[3] Landmark Univ, Dept Mech Engn, PMB 1001, Omu Aran, Kwara State, Nigeria
[4] NASENI, Dept Engn, Prototype Engn Dev Inst PEDI, Natl Agcy Sci & Engn Infrastruct, Ilesha, Nigeria
关键词
Medium-carbon steel; Electrodeposition; Copper; Morphology; Corrosion; Wear resistance; BATH;
D O I
10.1007/s11668-020-00982-y
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The work investigated the effects of pre-surface treatment on wear and corrosion rates of copper electrodeposition on medium-carbon steel. Medium-carbon steel samples were subjected to heat treatment (annealing, normalizing and quenching) in a muffle furnace. The samples were prepared and subjected to nickel striking and copper electroplating using standard bath composition. Electroplated samples were taken for weight test, optical microscopy, wear test and corrosion test. Result showed that the heat-treated copper-electrodeposited substrate had homogenous distribution of fine copper deposition, while the tempered heat-treated substrate was observed with the lowest wear rate of 3.5 x 10(-3) g/mm(3)/min and lowest corrosion rate of 0.01833 mmpy in seawater environment of 0.5 M NaCl, thus having a low resistance to wear and corrosion in saline environment. This research has established that un-electroplated medium-carbon steel is highly corrosive in saline environment due to its higher corrosion penetration rates, while the tempered heat-treated copper-electrodeposited steels are lowly corrosion resistant and therefore suitable for use as a good material of choice in saline environments.
引用
收藏
页码:1754 / 1764
页数:11
相关论文
共 12 条
[1]  
Ajibola O.O., 2014, J COAT, V2014, P1, DOI [10.1155/2014/841619, DOI 10.1155/2014/841619]
[2]  
Ajibola O.O., 2014, INT J INNOV APPL STU, V6, P420
[3]  
Ajibola O.O., 2015, AFR CORROS J, V2
[4]  
Ajibola OO, 2014, INT J INNOV SCI RES, V8, P334
[5]   Voltammetric study and electrodeposition of copper in 1-butyl-3-methylimidazolium salicylate ionic liquid [J].
Chen, Po-Yu ;
Chang, Yu-Ting .
ELECTROCHIMICA ACTA, 2012, 75 :339-346
[6]  
Momoh I.M., 2012, J SCI TECHNOL, V1, P400
[7]  
Oluwole O, 2010, LEONARDO ELECT J PRA, V9, P33
[8]   Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives [J].
Pasquale, M. A. ;
Gassa, L. M. ;
Arvia, A. J. .
ELECTROCHIMICA ACTA, 2008, 53 (20) :5891-5904
[9]   Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique [J].
Pecequilo, Cristiane Vargas ;
Panossian, Zehbour .
ELECTROCHIMICA ACTA, 2010, 55 (12) :3870-3875
[10]  
Popoola A. P. I., 2011, INT J PHY SCI, V6, P2447, DOI DOI 10.1016/J.CORSCI.2009.10.008