Dynamic Characteristics of AlGaN/GaN Fin-MISHEMTs With Al2O3 Dielectric

被引:17
作者
Zhou, Xingye [1 ]
Tan, Xin [1 ]
Lv, Yuanjie [1 ]
Wang, Yuangang [1 ]
Song, Xubo [1 ]
Gu, Guodong [1 ]
Xu, Peng [1 ]
Guo, Hongyu [1 ]
Feng, Zhihong [1 ]
Cai, Shujun [1 ]
机构
[1] Hebei Semicond Res Inst, Natl Key Lab ASIC, Shijiazhuang 050051, Hebei, Peoples R China
基金
中国国家自然科学基金;
关键词
Dynamic characteristics; FinFET; gallium nitride (GaN)-based device; trapping effect; ELECTRON-MOBILITY TRANSISTORS; INDUCED CURRENT COLLAPSE; BUFFER; HEMTS; TRAPS; IMPACT;
D O I
10.1109/TED.2018.2792060
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An extensive investigation of fabricated AlGaN/GaN fin-shaped metal-insulator-semiconductor high-electron-mobility transistors (Fin-MISHEMTs) with Al2O3 dielectric is presented in this paper. Based on the pulsed I-V measurements and numerical simulation, the dynamic characteristics of GaN-based Fin-MISHEMTs were carried out under various quiescent bias conditions and temperatures. Moreover, the physical mechanisms of current collapse and dynamic on-resistance increase induced by trapping effects were analyzed. The results show that the observed nonmonotonic variation of current collapse with the gate quiescent bias voltage is resulted from the combination of gate leakage injection-related and hot-electron injection-related trapping effects. Compared with the conventional planar MISHEMTs, the current collapse of AlGaN/GaN Fin-MISHEMTs is smaller due to lower gate leakage and smaller threshold voltage shift, which is benefited from its enhanced gate controllability. The current collapse and dynamic on-resistance increase of Fin-MISHEMTs can be further suppressed by optimizing the device structure, such as designing the fin channels only under the gate.
引用
收藏
页码:928 / 935
页数:8
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