PECVD as an effective tool for thin film encapsulation of OLED displays

被引：0
|
作者：
Lifka, H. [1 ]
Rosink, J. J. W. M. [1 ]
van Esch, H. A. [1 ]
机构：
[1] Philips Res Labs, NL-5656 AA Eindhoven, Netherlands
来源：
IDMC 05: PROCEEDINGS OF THE INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE 2005 | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Organic light emitting displays can be made as thin as the substrate when thin film packaging is used. We use a multi-stack approach of silicon-nitride (N) and silicon oxide(O) PECVD layers as a barrier. We present results on the moisture resistance properties of this stack. The water permeability of a single NON stack deposited at 80 degrees C was measured to be less than 1*10(-6) g/m(2) day. The compatibility and device results will be shown.
引用
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页码：388 / 389
页数：2
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