Wafer-level MEMS Package and Its Reliability Issues

被引：0

作者：

Tanaka, Shuji ^{[1
]}

Esashi, Masayoshi ^{[1
]}

机构：

[1] Tohoku Univ, Sendai, Miyagi 980, Japan

来源：

2013 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2013年

关键词：

Wafer-level packaging; Micro electro mechanical systems (MEMS); Anodic bonding; Electrical feedthrough; Low temperature cofired ceramics (LTCC);

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O-2 generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. A new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.

引用

页数：5

共 19 条

[1] Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators [J].