Heat Dissipation Analysis of High Power LED Package

被引：0
|
作者：
Lu, Jianhua [1 ]
机构：
[1] Yancheng Teachers Univ, Sch New Energy & Elect Engn, 2 Xiwang Rd, Yancheng City 224051, Jiangsu, Peoples R China
来源：
2017 14TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (SSLCHINA) : INTERNATIONAL FORUM ON WIDE BANDGAP SEMICONDUCTORS (IFWS) | 2017年
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
With the increasing output power of LED chip, heat dissipation analysis and design of high-power LED has become one of the key technologies of LED packaging. In this paper, the three-dimensional packaging model of high-power LED is established. The finite element method is used to simulate the temperature field distribution of LED. The influence of bonding material and substrate thickness on the heat dissipation of LED package is analyzed by changing the relevant parameters of LED package, and this method has a certain guiding significance on optimizing the LED package.
引用
收藏
页码：189 / 192
页数：4
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