Grain morphology of intermetallic compounds at solder joints

被引：58

作者：

Choi, WK ^{[1
]}

Jang, SY ^{[1
]}

Kim, JH ^{[1
]}

Paik, KW ^{[1
]}

Lee, HM ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Yusung Gu, Taejon 305701, South Korea

来源：

JOURNAL OF MATERIALS RESEARCH | 2002年 / 17卷 / 03期

关键词：

D O I：

10.1557/JMR.2002.0084

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu,Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter alpha was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.

引用

页码：597 / 599

页数：3

共 20 条

[1]

BADER S, 1995, ACTA METALL MATER, V43, P329, DOI 10.1016/0956-7151(94)00224-6

[2] THEORY OF CRYSTAL GROWTH AND INTERFACE MOTION IN CRYSTALLINE MATERIALS [J].

CAHN, JW .

ACTA METALLURGICA, 1960, 8 (08) :554-562

[3]

CAHN RW, 1996, PHYSICAL METALLURGY, P702

[4]

CHERNOV AA, 1984, MODERN CRYSTALLOGR, V3

[5] Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate [J].

Choi, WK ;

Lee, HM .

JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1251-1255

[6] Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate [J].

Choi, WK ;

Yoon, SW ;

Lee, HM .

MATERIALS TRANSACTIONS, 2001, 42 (05) :783-789

[7] Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate [J].

Choi, WK ;

Lee, HM .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) :1207-1213

[8]

Jackson K.A., 1958, LIQUID METALS SOLIDI, P174

[9] Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology [J].

Jang, JW ;

Kim, PG ;

Tu, KN ;

Frear, DR ;

Thompson, P .

JOURNAL OF APPLIED PHYSICS, 1999, 85 (12) :8456-8463

[10] RATE OF CONSUMPTION OF CU IN SOLDERING ACCOMPANIED BY RIPENING [J].

KIM, HK ;

TU, KN .

APPLIED PHYSICS LETTERS, 1995, 67 (14) :2002-2004

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