Morphologies and grain orientations of Cu-Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

被引：24

作者：

Liu, Wei ^{[1
]}

Tian, Yanhong ^{[1
]}

Wang, Chunqing ^{[1
]}

Wang, Xuelin ^{[1
]}

Liu, Ruiyang ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

来源：

MATERIALS LETTERS | 2012年 / 86卷

基金：

美国国家科学基金会;

关键词：

Interfaces; Intermetallic alloys and compounds; Orientation; Morphology; MOLTEN SN; SUBSTRATE; GROWTH; SUPERSTRUCTURE; ETA-CU6SN5; INTERFACE; EVOLUTION; CU3SN;

D O I：

10.1016/j.matlet.2012.07.016

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Morphologies and grain orientations of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) at the interface of Sn3.5Ag0.5Cu lead-free solder alloy and copper substrates were investigated by Electron Backscatter Diffraction (EBSD) technology combined with Scanning Electron Microscopy (SEM). Scalloped Cu6Sn5, Cu6Sn5 planes and six-prism shaped Cu6Sn5 IMCs were observed at the interface after 48 h of soldering at 250 degrees C. Moreover, Cu6Sn5 planes emerged in pairs on top and beside the scalloped Cu6Sn5, and two adjacent Cu6Sn5 planes were with an angle of 120 degrees. Cu3Sn and scalloped Cu6Sn5 IMCs had preferred orientations, and they were Cu6Sn5 (0001)parallel to substrate surface, and Cu3Sn ((1) over bar 00) and (100)parallel to substrate surface. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：157 / 160

页数：4

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