Design and Electrical Analysis for Adavanced Fan-out Package-on-Package

With regard to the development trend of smartphone, the smartphone is equipped with high definition display, and a thin and light dimension. The mobile phone is continued to decrease body thickness, and most components should follow the trend, including display panel module, covering panel glass, phone case, battery, camera module, PCB, IC package ... etc. In this paper, the fan-out wafer level package (FOWLP) is investigated in mobile application, and compared with traditional package solutions, including package design, structure and electrical performance, and the IC package of application processor (AP) is as the importance of this study. For the application processor (AP) investigation, the thickness of fan-out package on package (FOPoP) is about 35% less than traditional package on package (MAPPoP), and the signal/ power integrity of FOPoP is about 15-85% better than MAPPoP. The fan-out wafer level package (FOWLP) is a better solution to be applied in mobile phones, which introduces the advantages of package form factor, high density integration and good performance [1].