On-chip temperature control circuit using common devices

被引：0

作者：

Braun, FD ^{[1
]}

Parent, DW ^{[1
]}

Papalias, TA ^{[1
]}

机构：

[1] San Jose State Univ, San Jose, CA 95192 USA

来源：

CICC: PROCEEDINGS OF THE IEEE 2005 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2005年

关键词：

analog integrated circuits; cooling; heating; temperature; temperature control;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A circuit has been designed to control the temperature of the IC die upon which it resides. No special devices or layers are required. No external circuitry or special heat sinking is used. Equilibrium temperatures from below -40 degrees C to above +85 degrees C are attainable. Time to equilibrium is on the order of a few seconds. The 400 mu m x 500 mu m circuit has been manufactured by the MOSIS service in a TSMC 0.25 micron process and installed in a 40-pin DIEP package. Test results reveal temperature regulation within 0.3 degrees C for thermal control ranges of 4 degrees C to 40 degrees C.

引用

页码：215 / 218

页数：4

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