ΩFETs transistors with TiN metal gate and HfO2 down to 10nm

被引:0
|
作者
Jahan, C [1 ]
Faynot, O [1 ]
Cassé, M [1 ]
Ritzenthaler, R [1 ]
Brévard, L [1 ]
Tosti, L [1 ]
Garros, X [1 ]
Vizioz, C [1 ]
Allain, F [1 ]
Papon, AM [1 ]
Dansas, H [1 ]
Martin, F [1 ]
Vinet, M [1 ]
Guillaumot, B [1 ]
Toffoli, A [1 ]
Giffard, B [1 ]
Deleonibus, S [1 ]
机构
[1] CEA, LETI, F-38054 Grenoble 9, France
来源
2005 Symposium on VLSI Technology, Digest of Technical Papers | 2005年
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
For the first time, TiN metal gate and high K gate dielectric (HfO2) have been successfully integrated on non planar Omega FETs transistors, with gate lengths down to 10nm. NMOS transistors exhibit an excellent I-ON/I-OFF ratio of 5. 10(5), the best value ever reported for a 10nm non planar device. The use of HfO2 reduces the gate leakage current by several orders of magnitude, for EOT of 1.92nm. Very low off-currents are measured with high on-currents, demonstrating the interest of such devices for low power applications.
引用
收藏
页码:112 / 113
页数:2
相关论文
共 50 条
  • [1] Ferroelectric Gate Field-Effect Transistors with 10nm Thick Nondoped HfO2 Utilizing Pt Gate Electrodes
    Kim, Min Gee
    Kataoka, Masakazu
    Mailig, Rengie Mark D.
    Ohmi, Shun-ichiro
    IEICE TRANSACTIONS ON ELECTRONICS, 2020, E103C (06): : 280 - 285
  • [2] Comparative scalability of PVD and CVD TiN on HfO2 as a metal gate stack for FDSOI cMOSFETs down to 25nm gate length and width
    Andrieu, F.
    Faynot, O.
    Garros, X.
    Lafond, D.
    Buj-Dufournet, C.
    Tosti, L.
    Minoret, S.
    Vidal, V.
    Barbe, J. C.
    Allain, F.
    Rouchouze, E.
    Vandroux, L.
    Cosnier, V.
    Casse, M.
    Delaye, V.
    Carabasse, C.
    Burdin, M.
    Rolland, G.
    Guillaumot, B.
    Colonna, J. P.
    Besson, P.
    Brevard, L.
    Mariolle, D.
    Holliger, P.
    Vandooren, A.
    Fenouillet-Beranger, C.
    Martin, F.
    Deleonibus, S.
    2006 INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2006, : 382 - +
  • [3] Dominant SILC mechanisms in HfO2/TiN gate NMOS and PMOS transistors
    Krishnan, SA
    Peterson, JJ
    Young, CD
    Brown, G
    Choi, R
    Harris, R
    Sim, JH
    Zeitzoff, P
    Kirsch, P
    Gutt, J
    Li, HJ
    Matthews, K
    Lee, JC
    Lee, BH
    Bersuker, G
    2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, : 642 - 643
  • [4] Analysis of electron mobility in HfO2/TiN gate metal-oxide-semiconductor field effect transistors: The influence of HfO2 thickness, temperature, and oxide charge
    Negara, M. A.
    Cherkaoui, K.
    Hurley, P. K.
    Young, C. D.
    Majhi, P.
    Tsai, W.
    Bauza, D.
    Ghibaudo, G.
    JOURNAL OF APPLIED PHYSICS, 2009, 105 (02)
  • [5] 50-nm fully depleted SOICMOS technology with HfO2 gate dielectric and TiN gate
    Vandooren, A
    Egley, S
    Zavala, M
    Stephens, T
    Mathew, L
    Rossow, M
    Thean, A
    Barr, A
    Shi, Z
    White, T
    Pham, D
    Conner, J
    Prabhu, L
    Triyoso, D
    Schaeffer, J
    Roan, D
    Nguyen, BY
    Orlowski, M
    Mogab, J
    IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2003, 2 (04) : 324 - 328
  • [6] Metal gate MOSFETs with HfO2 gate dielectric
    Samavedam, SB
    Tseng, HH
    Tobin, PJ
    Mogab, J
    Dakshina-Murthy, S
    La, LB
    Smith, J
    Schaeffer, J
    Zavala, M
    Martin, R
    Nguyen, BY
    Hebert, L
    Adetutu, O
    Dhandapani, V
    Luo, TY
    Garcia, R
    Abramowitz, P
    Moosa, M
    Gilmer, DC
    Hobbs, C
    Taylor, WJ
    Grant, JM
    Hedge, R
    Bagchi, S
    Luckowski, E
    Arunachalam, V
    Azrak, M
    2002 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2002, : 24 - 25
  • [7] 55nm high mobility SiGe(:C) pMOSFETs with HfO2 gate dielectric and TiN metal gate for advanced CMOS
    Weber, O
    Ducroquet, F
    Ernst, T
    Andrieu, F
    Damlencourt, JF
    Hartmann, JM
    Guillaumot, B
    Papon, AM
    Dansas, H
    Brévard, L
    Toffoli, A
    Besson, P
    Martin, F
    Morand, Y
    Deleonibus, S
    2004 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2004, : 42 - 43
  • [8] Strained FDSOI CMOS technology scalability down to 2.5nm film thickness and 18nm gate length with a TiN/HfO2 gate stack
    Barral, V.
    Poiroux, T.
    Andrieu, F.
    Buj-Dufournet, C.
    Faynot, O.
    Ernst, T.
    Brevard, L.
    Fenouillet-Beranger, C.
    Lafond, D.
    Hartmann, J. M.
    Vidal, V.
    Allain, F.
    Daval, N.
    Cayrefourcq, I.
    Tosti, L.
    Munteanu, D.
    Autran, J. L.
    Deleonibus, S.
    2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, : 61 - +
  • [9] Physical and electrical characterization of polysilicon vs. TiN gate electrodes for HfO2 transistors
    Lysaght, PS
    Peterson, JJ
    Foran, B
    Young, CD
    Bersuker, G
    Huff, HR
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2004, 7 (4-6) : 259 - 263
  • [10] Equivalent Circuit Model for the Gate Leakage Current in Broken Down HfO2/TaN/TiN Gate Stacks
    Miranda, Enrique
    Pey, Kin-Leong
    Ranjan, Rakesh
    Tung, Chih-Hang
    IEEE ELECTRON DEVICE LETTERS, 2008, 29 (12) : 1353 - 1355