Morphological effects and their relation with the electrical resistivity measured during the initial stages of growth of Au/glass films

被引：1

作者：

Corona, JE ^{[1
]}

Oliva, AI ^{[1
]}

机构：

[1] IPN, CINVESTAV, Dept Appl Phys, Merida 97310, Yucatan, Mexico

来源：

2005 2nd International Conference on Electrical & Electronics Engineering (ICEEE) | 2005年

关键词：

electrical resistivity; gold films; morphology;

D O I：

10.1109/ICEEE.2005.1529608

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The electrical resistivity measured during the first stages of growth on gold thin films is compared with the surface morphology data obtained in order to relate the percolation effects observed on the AFM images. By using a free-software WSxM Ver 7.1 from Nanotec we analyzed the surface of gold films deposited on glass substrates by thermal evaporation by means of flooding surfaces. Film thickness was ranged from 4 to 40 nm. Results show a clear dependence between surface characteristics and the electrical resistivity, meaning that observed percolation effects on films have a large influence on the electrical resistivity. Poor physical connections between grains in the first 15 nm of thickness are the main cause of the observed effects.

引用

页码：204 / 206

页数：3