Dielectric properties of micropatterns consisting of barium titanate single-crystalline nanocubes

Micropatterns of barium titanate nanocube (BT NC) assemblies were fabricated by dip-coating self-assembly using a micropatterned mold made of Si or polyimide (PI). The microstructure of the BT NC assembly in the micropatterned mold made of PI showed the closest packing structure. This result indicated that the polymer wall in the micropatterns is swollen by the organic solvent used in the dip-coating self-assembly process. As a result, this swelling might work effectively for the self-assembly of the NCs with high ordering assisted by capillary force. Moreover, it is clarified that the line-and-space-molds with a taper angle and a large width were more useful for the self-assembly of BT NCs in microtrenches selectively. The micropatterned mold made of PI could be removed by immersing in N-methyl-2-pyrrolidone at 65 degrees C. The ordered structure was not destroyed during the removal process. Micropatterned BT NC capacitor structures were obtained by this method after sintering at 850 degrees C. The interfaces of BT NCs were conjugated face-to-face, as shown by the obtained high-resolution transmission electron microscopy (HR-TEM) cross-sectional profiles. This process has a great potential for fabricating patterned assemblies directly on substrates. The dielectric properties of BT NC micropatterned assemblies in micropatterned molds made of Si were also characterized and compared with those of BT NC assemblies on Pt/Si substrates without micropatterning. (C) 2015 The Japan Society of Applied Physics