Real-time strength development monitoring for concrete structures using wired and wireless electro-mechanical impedance techniques

被引:26
作者
Kim, Ju-Won [1 ]
Lee, Changgil [2 ]
Park, Seunghee [2 ]
Koh, Kyung-Taek [3 ]
机构
[1] Sungkyunkwan Univ, Dept U City Design & Engn, Suwon 440746, South Korea
[2] Sungkyunkwan Univ, Dept Civil & Environm Engn, Suwon 440746, South Korea
[3] Korea Inst Construct Technol, SOC Res Inst, Struct Engn Res Div, Goyang 411712, South Korea
关键词
concrete curing strength; wireless sensor node; piezoelectric sensor; impedance; high strength concrete; HEALTH; MODEL;
D O I
10.1007/s12205-013-0390-1
中图分类号
TU [建筑科学];
学科分类号
0813 ;
摘要
The demand for the construction of high-rise buildings and wide-span bridges using High Strength Concrete (HSC) has increased. To prevent unexpected collapse during and after the construction of HSC structures, it is essential to confirm the strength development of HSC during the curing process. In this study, a novel method to estimate the strength development of HSC based on Electromechanical Impedance (EMI) measurements using a wireless sensor node is proposed. The EMI of HSC structures with 100 MPa strength was tracked to monitor the strength development. In addition, two types of signal processing, resonant frequency shift and cross-correlation coefficient were applied in sequence to examine the trend of the impedance variations more quantitatively. The results confirmed that the proposed technique can be applied successfully to more reliable and economical monitoring of the strength development during the curing process of HSC structures.
引用
收藏
页码:1432 / 1436
页数:5
相关论文
共 24 条
[1]   Three-dimensional electromechanical impedance model. I: Formulation of directional sum impedance [J].
Annamdas, Venu Gopal Madhav ;
Soh, Chee Kiong .
JOURNAL OF AEROSPACE ENGINEERING, 2007, 20 (01) :53-62
[2]   Application of Electromechanical Impedance Technique for Engineering Structures: Review and Future Issues [J].
Annamdas, Venu Gopal Madhav ;
Soh, Chee Kiong .
JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES, 2010, 21 (01) :41-59
[3]  
[Anonymous], SMART MAT STRUCTURES
[4]   Structural health monitoring by piezo-impedance transducers. I: Modeling [J].
Bhalla, S ;
Soh, CK .
JOURNAL OF AEROSPACE ENGINEERING, 2004, 17 (04) :154-165
[5]  
Giurgiutiu V, 1997, STRUCTURAL HEALT H MONITORING, P433
[6]  
Gyuhae Park, 2003, Shock and Vibration Digest, V35, P451, DOI 10.1177/05831024030356001
[7]  
Irie H., 2008, NTT Tech. Rev., V6, P1
[8]  
Lamond JF, 2006, AM SOC TEST MATER, V169D, P1, DOI 10.1520/STP169D-EB
[9]   Active self-sensing scheme development for structural health monitoring [J].
Lee, Sang Jun ;
Sohn, Hoon .
SMART MATERIALS AND STRUCTURES, 2006, 15 (06) :1734-1746
[10]   Time Reversal Based Piezoelectric Transducer Self-diagnosis Under Varying Temperature [J].
Lee, Sang Jun ;
Sohn, Hoon ;
Hong, Jung-Wuk .
JOURNAL OF NONDESTRUCTIVE EVALUATION, 2010, 29 (02) :75-91