Finite element analysis of ink-tack delamination of paperboard

被引：13

作者：

Hallbäck, N ^{[1
]}

Girlanda, O

Tryding, J

机构：

[1] Karlstad Univ, Div Engn Sci Phys & Math, SE-65188 Karlstad, Sweden

[2] STFI Packforsk, SE-11486 Stockholm, Sweden

[3] Tetra Pak Carton Ambient AB, SE-22186 Lund, Sweden

来源：

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES | 2006年 / 43卷 / 05期

关键词：

ink-tack delamination; paperboard; interface strength;

D O I：

10.1016/j.ijsolstr.2005.06.030

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

Finite element analysis of ink-tack delamination of paperboard were presented. The paperboard was modeled as a multilayered structure with a softening interface model connecting the paperboard plies. The paperboard plies were modeled as orthotropic linear elastic. The ink-tack loading was applied to the board in the form of a moving displacement boundary condition. The purpose of the analysis was to assess the influence from the elastic moduli of the individual layers on the ink-tack delamination event. The results indicated that in most cases of practical interest the board delaminated between the outer plies of the board, although the interface strength was lower in the middle of the board. This observation helped to explain why traditional tests for out-of-plane testing of paper by standardized methods could not uniquely predict the propensity for ink-tack delamination. (c) 2005 Elsevier Ltd. All rights reserved.

引用

页码：899 / 912

页数：14

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