Liquidus projection of Sn-Co-Ni ternary system

被引:0
作者
Chen, Tung-kai [1 ]
Hsu, Chia-ming [1 ]
Chen, Sinn-wen [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 30013, Taiwan
来源
2012 7TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | 2012年
关键词
INTERMETALLIC COMPOUND FORMATION; INTERFACIAL REACTIONS; SN-3.5AG SOLDER; AG SOLDER;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页数:4
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