The important role of strain on phonon hydrodynamics in diamond-like bi-layer graphene

被引:35
作者
Hu, Yanxiao [1 ]
Li, Dengfeng [1 ]
Yin, Yan [1 ]
Li, Shichang [1 ]
Ding, Guangqian [1 ]
Zhou, Hangbo [2 ]
Zhang, Gang [2 ]
机构
[1] Chongqing Univ Posts & Telecommun, Sch Sci, Chongqing 400065, Peoples R China
[2] ASTAR, Inst High Performance Comp, Singapore 138632, Singapore
基金
中国国家自然科学基金;
关键词
thermal conduction; bi-layer graphene; strain effect; THERMAL-CONDUCTIVITY; ELASTIC PROPERTIES; TRANSPORT; TEMPERATURE; SIMULATION; DIAMANE; FILMS;
D O I
10.1088/1361-6528/ab8ee1
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this work, combining first-principles calculation and the phonon Boltzmann transport equation, we explored the diffusive thermal conductivity of diamond-like bi-layer graphene. The converged iterative solution provides high room temperature thermal conductivity of 2034 W mK(-1), significantly higher than other 2D materials. More interesting, the thermal conductivity calculated by relaxation time approximation is about 33% underestimated, revealing a remarkable phonon hydrodynamic transport characteristic. Significant strain dependence is reported, for example, under 5% tensile strain, room temperature thermal conductivity (1081 W mK(-1)) of only about 50% of the strain-free sample, and under 20% strain, it reduces dramatically to only about 11% of the intrinsic one (226 W mK(-1)). Unexpectedly, in addition to the remarkable reduction in the absolute value of thermal conductivity, tensile strain can impact the hydrodynamic significance. For example, under 5% strain, the underestimation of relaxation time approximation in thermal conductivity is reduced to 20%. Furthermore, using a non-equilibrium Green's function calculation, high ballistic thermal conductance (2.95 GW m(-2) K-1) is demonstrated, and the mean free path is predicted to be 700 nm at room temperature. The importance of the knowledge of phonon transport in diamond-like bi-layer graphene goes beyond fundamental physics owing to its relevance to thermal management applications due to the super-high thermal conduction.
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页数:9
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