220-GHz Solid-State Power Amplifier Modules

被引:50
作者
Radisic, Vesna [1 ]
Leong, Kevin M. K. H. [1 ]
Sarkozy, Stephen [1 ]
Mei, Xiaobing [1 ]
Yoshida, Wayne [1 ]
Liu, Po-Hsin [1 ]
Deal, William R. [1 ]
Lai, Richard [1 ]
机构
[1] Northrop Grumman Aerosp Syst, Redondo Beach, CA 90278 USA
关键词
Coplanar waveguide (CPW); HEMT; monolithic microwave integrated circuit (MMIC); power amplifier (PA); solid-state power amplifier (SSPA);
D O I
10.1109/JSSC.2012.2204923
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on several solid-state power amplifier (PA) modules operating at frequencies around the 220-GHz propagation window. Included is a single module demonstrating saturated output power >= 60 mW from 205 to 225 GHz and peak output power of 75 mW at 210 GHz using eight-way on-chip power combining. The output power is further increased by using wave-guide power combining with WR-4 waveguide. Results include a single two-way combined module achieving >100 mW of power from 210 to 225 GHz and four-way combining using two two-way combiners to reach 185 mW of output power at 210 GHz. The amplifier MMICs uses sub-50-nm InP HEMT transistors, coplanar waveguide (CPW) technology, and on-chip electromagnetic transitions to waveguide. Finally, preliminary burn-in and initial room-temperature lifetest data is shown.
引用
收藏
页码:2291 / 2297
页数:7
相关论文
共 10 条
[1]  
[Anonymous], 2011, PROC IEEE COMPOUND S
[2]   THz Imaging Radar for Standoff Personnel Screening [J].
Cooper, Ken B. ;
Dengler, Robert J. ;
Llombart, Nuria ;
Thomas, Bertrand ;
Chattopadhyay, Goutam ;
Siegel, Peter H. .
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2011, 1 (01) :169-182
[3]   A 20-mW G-band monolithic driver amplifier using 0.07-μm InPHEMT [J].
Huang, P. ;
Lai, R. ;
Grundbacher, R. ;
Gorospe, B. .
2006 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-5, 2006, :806-809
[4]   A 200 GHz Monolithic Integrated Power Amplifier in Metamorphic HEMT Technology [J].
Kallfass, I. ;
Pahl, P. ;
Massler, H. ;
Leuther, A. ;
Tessmann, A. ;
Koch, S. ;
Zwick, T. .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2009, 19 (06) :410-412
[5]  
Lai R., 2008, Indium Phosphide and Related Materials, P1
[6]   A 340-380 GHz Integrated CB-CPW-to-Waveguide Transition for Sub Millimeter-Wave MMIC Packaging [J].
Leong, Kevin M. K. H. ;
Deal, William R. ;
Radisic, Vesna ;
Mei, Xiao Bing ;
Uyeda, Jansen ;
Samoska, Lorene ;
Fung, Andy ;
Gaier, Todd ;
Lai, Richard .
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2009, 19 (06) :413-415
[7]  
Mei X. B., 2010, P INP REL MAT C P MA, P1
[8]   G-band (140-220 GHz) and W-Band (75-110 GHz) InP DHBT medium power amplifiers [J].
Paidi, VK ;
Griffith, Z ;
Wei, Y ;
Dahlstrom, M ;
Urteaga, M ;
Parthasarathy, N ;
Seo, M ;
Samoska, L ;
Fung, A ;
Rodwell, MJW .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2005, 53 (02) :598-605
[9]  
Radisic V, 2010, IEEE MTT S INT MICR, P45, DOI 10.1109/MWSYM.2010.5515248
[10]   Present and Future of Terahertz Communications [J].
Song, Ho-Jin ;
Nagatsuma, Tadao .
IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2011, 1 (01) :256-263