Fast method to determine the structural defect density of 156 x 156 mm2 mc-Si wafers

被引:4
作者
Bakowskie, R. [1 ]
Kesser, G. [1 ]
Richter, R. [2 ]
Lausch, D. [3 ]
Eidner, A. [1 ]
Clemens, P. [4 ]
Petter, K. [1 ]
机构
[1] Q Cells SE, OT Thalheim, Sonnenallee 17-21, D-06766 Bitterfeld, Germany
[2] Compact Dynam GmbH, D-82319 Starnberg, Germany
[3] Fraunhofer Ctr Silicon Photovolta CSP, D-06120 Halle, Germany
[4] Greencells GmbH, D-66111 Saarbrucken, Germany
来源
PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS (SILICONPV 2012) | 2012年 / 27卷
关键词
structural defects; defect density; dislocations; defect mapping; multicrystalline silicon;
D O I
10.1016/j.egypro.2012.07.048
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Today a remaining challenge is to determine the structural defect density (SDD) on a whole 156 x 156 mm(2) multicrystalline (mc) silicon wafer over a timescale of a few minutes. In this contribution a new method is introduced to determine the SDD on large scale mc-Si wafers. The main advantage of the method presented is the possibility to obtain a complete map of the SDD of a 156 x 156 mm(2) mc-Si wafer as well as a quantitative SDD analysis of the wafer in just a few minutes. Furthermore, the simple and quick sample preparation as well as the application of standard measurement equipment results in a convenient and cost-effective analysis tool. With these advantages, analysis of SDDs on large quantities of wafers, e. g. across the ingot height or width, can be easily realized in a few hours. (C) 2012 Published by Elsevier Ltd. Selection and peer-review under responsibility of the scientific committee of the SiliconPV 2012 conference.
引用
收藏
页码:179 / 184
页数:6
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