Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects

被引:6
|
作者
Wu, Zhuo-Jie [1 ]
Ho, Paul S. [1 ]
机构
[1] Univ Texas Austin, Microelect Res Ctr, Austin, TX 78758 USA
关键词
RESISTIVITY; FILMS; MODEL;
D O I
10.1063/1.4750067
中图分类号
O59 [应用物理学];
学科分类号
摘要
We report a classical model on the size effect of the electron wind force on a metal atom at the metal-dielectric interface in nanoscale interconnects. The effect is expressed as a size factor S for the effective charge Z*e. It is found that the size factor decreases with scaling due to reduced electron drift momentum as a result of scattering at interfaces and grain boundaries. The electron wind force on the metal atoms at the top metal-dielectric interface is enhanced by the interface scattering. This force enhancement is partially mitigated by the grain boundary scattering. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4750067]
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页数:5
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