A Co-packaged Photoelectric Converter Module

Microwave photonics technology (MWP), which has been applied to various radar, Telcom, Electronic Warfare systems, is now facing more and more challenging development trend of miniaturization and modular array for increasing node counts and system complexity. The hybrid-integration microassembly process, which could effectively realize the integrated system of photonic devices, microwave devices and electrical circuits, are utilized to achieve small volume and simple preparation technology for rapid engineering and miniaturization. In this paper, we introduced an ultra-compact photoelectric converter array module fabricated with hybrid-integration microassembly process, the practical test results showed a good optical coupling and S-parameters over a wide frequency range. Furthermore, this could be easily expanded for multi-channels MWP application scenarios.