Thin Wafer Stencil Print Coating

被引：0

作者：

Schake, J. ^{[1
]}

Whitmore, M. ^{[2
]}

Foggie, D. ^{[2
]}

Brown, M. ^{[2
]}

机构：

[1] DEK USA Inc, Rolling Meadows, IL 60008 USA

[2] DEK Printing Machines Ltd, Weymouth DT49TH, England

来源：

CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010) | 2010年 / 27卷 / 01期

关键词：

D O I：

10.1149/1.3360640

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Applications for stencil print wafer coating include protective coating and die attach adhesive applied on the backside and non-capillary active component protection on the front side. 200mm diameter wafers thinned to 150um were used in this study to identify correlation between coating thickness control and wafer support tooling surface metrology. The data indicates coating thickness capability ratio (C-p) improvement exceeds 4x between best and worst performing wafer chucks, confirming our prediction that stricter chuck design tolerances are required for stencil print coating thinner wafers.

引用

页码：327 / 337

页数：11