Reliability of High-Temperature Operation for GaN-Based Operational Amplifiers

被引:1
作者
Nomoto, Kazuki [1 ]
Hasegawa, Kazuya [1 ]
Satoh, Masataka [1 ]
Nakamura, Tohru [1 ]
机构
[1] Hosei Univ, Res Ctr Micronano Technol, Koganei, Tokyo 184, Japan
来源
RELIABILITY AND MATERIALS ISSUES OF SEMICONDUCTOR OPTICAL AND ELECTRICAL DEVICES AND MATERIALS | 2010年 / 1195卷
关键词
HEMTS;
D O I
10.1557/PROC-1195-B08-02
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrated electrical characteristics of operational amplifier (OPAMP) circuits fabricated by GaN/AlGaN/GaN HEMTs operating over 100 degrees C. GaN/AlGaN/GaN HEMTs, with the extremely low source resistance were fabricated by multiple ion implantation, precisely controlled ion-implanted (I/I) resistors and Schottky barrier diodes were integrated on the silicon substrate. The GaN cap layer on the AlGaN was grown to decrease the gate leakage current and current collapse for AlGaN/GaN HEMTs.
引用
收藏
页数:4
相关论文
共 10 条
[1]   High-temperature operation of AlGaN/GaN HEMTs direct-coupled FET logic (DCFL) integrated circuits [J].
Cai, Yong ;
Cheng, Zhiqun ;
Yang, Zhenchuan ;
Tang, Chak Wah ;
Lau, Kei May ;
Chen, Kevin J. .
IEEE ELECTRON DEVICE LETTERS, 2007, 28 (05) :328-331
[2]   The effect of an Fe-doped GaN buffer on OFF-State breakdown characteristics in AlGaN/GaN HEMTs on Si substrate [J].
Choi, Young Chul ;
Pophristic, Milan ;
Cha, Ho-Young ;
Peres, Boris ;
Spencer, Michael G. ;
Eastman, Lester F. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (12) :2926-2931
[3]   AlGaN/GaN high electron mobility transistors on Si(111) substrates [J].
Chumbes, EM ;
Schremer, AT ;
Smart, JA ;
Yang, Y ;
MacDonald, NC ;
Hogue, D ;
Komiak, JJ ;
Lichwalla, SJ ;
Leoni, RE ;
Shealy, JR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (03) :420-426
[4]   GaNHFET digital circuit technology for harsh environments [J].
Hussain, T ;
Micovic, M ;
Tsen, T ;
Delaney, M ;
Chow, D ;
Schmitz, A ;
Hashimoto, P ;
Wong, D ;
Moon, JS ;
Hu, M ;
Duvall, J ;
McLaughlin, D .
ELECTRONICS LETTERS, 2003, 39 (24) :1708-1709
[5]   AlGaN-GaN HEMTs on patterned silicon (111) substrate [J].
Jia, S ;
Dikme, Y ;
Wang, DL ;
Chen, KJ ;
Lau, KM ;
Heuken, M .
IEEE ELECTRON DEVICE LETTERS, 2005, 26 (03) :130-132
[6]  
Joshin K, 2008, IEEE RADIO WIRELESS, P65
[7]   0.25 μm self-aligned AlGaN/GaN high electron mobility transistors [J].
Kumar, Vipan ;
Kim, D. H. ;
Basu, A. ;
Adesida, I. .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (01) :18-20
[8]   ALGaN/GaN moshfet integrated circuit power converter [J].
Pytel, SG ;
Lentijo, S ;
Koudymov, A ;
Rai, S ;
Fatima, H ;
Adivarahan, V ;
Chitnis, A ;
Yang, J ;
Hudgins, JL ;
Santi, E ;
Monti, A ;
Simin, G ;
Khan, MA .
PESC 04: 2004 IEEE 35TH ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-6, CONFERENCE PROCEEDINGS, 2004, :579-584
[9]   High breakdown voltage undoped AlGaN-GaN power HEMT on sapphire substrate and its demonstration for DC-DC converter application [J].
Saito, W ;
Kuraguchi, M ;
Takada, Y ;
Tsuda, K ;
Omura, I ;
Ogura, T .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (11) :1913-1917
[10]   High power RF switch MMICs development in GaN-on-Si HFET technology [J].
Yu, Mark ;
Ward, Robert J. ;
Hegazi, Gamal M. .
2008 IEEE RADIO AND WIRELESS SYMPOSIUM, VOLS 1 AND 2, 2008, :855-858