Manifold microchannel heat sinks: Isothermal analysis

被引:84
|
作者
Copeland, D
Behnia, M
Nakayama, W
机构
[1] UNIV NEW S WALES, SCH MECH & MFG ENGN, SYDNEY, NSW 2052, AUSTRALIA
[2] UNIV MARYLAND, CALCE ELECT PACKAGING RES CTR, COLLEGE PK, MD 20742 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1997年 / 20卷 / 02期
关键词
computational fluid dynamics; conjugate heat transfer; finite element analysis; liquid cooling; microchannel heat sink;
D O I
10.1109/95.588554
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Numerical analyses of manifold microchannel (MMC) heat sinks were performed, The MMC differs from a traditional microchannel heat sink in that the flow length is greatly reduced to a small fraction of the total length of the heat sink, Alternating inlet and outlet channels guide the coolant to and from the microchannels. A silicon heat sink cooled by fluorocarbon liquid was studied. The repetitive nature of the manifold and microchannels results in many planes of symmetry, The thermal and fluid characteristics of a MMC assembly can modeled by a ''unit cell'' bounded by the centerlines of the manifold inlet and outlet channels and by those of the microchannels and heat sink walls. Three-dimensional (3-D) finite element models of single manifold microchannels were constructed and used to simulate fluid flow and heat transfer, Conjugate analysis suggested that an isothermal model would produce suitably accurate results, In addition to coolant flow rate, channel length, width, and depth were varied. Regions of high heat transfer were found near the inlet, At higher inlet velocities, secondary maxima in heat transfer were seen at the base of the microchannel below the inlet, and at the top of the microchannel near the exit. The flow was found to accelerate to a greater extent than predicted by rectangular duct analysis.
引用
收藏
页码:96 / 102
页数:7
相关论文
共 50 条
  • [1] Manifold microchannel heat sinks: Isothermal analysis
    Copeland, D
    Behnia, M
    Nakayama, W
    INTERSOCIETY CONFERENCE ON THERMAL PHENOMENA IN ELECTRONIC SYSTEMS - I-THERM V, 1996, : 251 - 257
  • [2] Topology Optimization of Manifold Microchannel Heat Sinks
    Zhou, Yuqing
    Nomura, Tsuyoshi
    Dede, Ercan M.
    PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 740 - 746
  • [3] LIQUID METAL FLOWS IN MANIFOLD MICROCHANNEL HEAT SINKS
    Hu, Haibao
    Kuravi, Sarada
    Ren, Feng
    Hsu, Pei-feng
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2014, VOL 10, 2015,
  • [4] Manifold microchannel heat sinks: Conjugate and extended models
    Copeland, David
    Behnia, Masud
    Nakayama, Wataru
    International Journal of Microelectronic Packaging Materials and Technologies, 1998, 1 (02): : 139 - 152
  • [5] Optimization Under Uncertainty of Manifold Microchannel Heat Sinks
    Sarangi, Suchismita
    Bodla, Karthik K.
    Garimella, Suresh V.
    Murthy, Jayathi Y.
    INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND B, 2013, : 1141 - 1153
  • [6] Forced air cooling by using manifold microchannel heat sinks
    Kim, YI
    Chun, WC
    Kim, JT
    Pak, BC
    Baek, BJ
    KSME INTERNATIONAL JOURNAL, 1998, 12 (04): : 709 - 718
  • [7] Forced air cooling by using manifold microchannel heat sinks
    Yong H Kim
    Woo Chong Chun
    Jin Taek Kim
    Bock Choon Pak
    Byoung Joon Baek
    KSME International Journal, 1998, 12 : 709 - 718
  • [8] Heat transfer and flow issues in manifold microchannel heat sinks: a CFD approach
    Poh, ST
    Ng, EYK
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 246 - 250
  • [9] Investigative study of manifold microchannel heat sinks for electronic cooling design
    Ng, EYK
    Poh, ST
    JOURNAL OF ELECTRONICS MANUFACTURING, 1999, 9 (02): : 155 - 166
  • [10] Numerical investigation of novel manifold microchannel heat sinks with countercurrent regions
    Zhang, Jingzhi
    An, Jun
    Xin, Gongming
    Wang, Xinyu
    Zhou, Qiang
    Huang, Jinyin
    Wu, Zan
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2023, 214