Micro Dimple Fabrication on OFHC Copper by Laser Shock Processing

被引:0
作者
Li, Kangmei [1 ]
Hu, Yongxiang [1 ]
Yao, Zhenqiang
机构
[1] Shanghai Jiao Tong Univ, Sch Mech Engn, Shanghai 200240, Peoples R China
来源
ADVANCED MATERIALS AND PROCESS TECHNOLOGY, PTS 1-3 | 2012年 / 217-219卷
关键词
Micro dimple; OFHC copper; Laser shock processing; SEAL; WEAR;
D O I
10.4028/www.scientific.net/AMM.217-219.2246
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Micro dimples have been generally considered as a valuable texture which can improve lubrication and reduce wear of the sliding surfaces by acting as reservoirs of lubricants and grinding debris. Laser shock processing (LSP) is an innovative surface treatment technology which can modify metals and shape metallic parts accurately. In this study, a new process for micro dimple fabrication which could be called laser peen texturing (LPT) was proposed based on LSP. LPT experiments were performed on Oxygen-Free High Conductivity (OFHC) copper. Influences of experimental parameters on geometrical characteristics of micro dimples were investigated. It was found that after LPT, the pile up was generated around the dimple .The diameter, depth and aspect ratio of the micro dimples increase with the laser power density and repeated shock number, but all of them saturated gradually. From matellographic analysis, grain refinement was observed obviously beneath the dimple.
引用
收藏
页码:2246 / 2251
页数:6
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