Thermal post-buckling behavior of patched laminated panels under uniform and non-uniform temperature distributions

被引:0
|
作者
Lee, JJ
Oh, IK
Lee, I
Yeom, CH
机构
[1] Korea Adv Inst Sci & Technol, Dept Aerosp Engn, Yusong Gu, Taejon 305701, South Korea
[2] Korea Aerosp Res Inst, Airship Res Dept, Yusong Gu, Taejon 305333, South Korea
关键词
patched laminated panel; shell; thermal post-buckling; snapping phenomena; uniform and non-uniform temperature distributions; assumed strain finite element method;
D O I
暂无
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
The thermal post-buckling analysis of patched laminated panels under uniform and non-uniform temperature distributions has been performed using a finite element method based on the Hellinger-Reissner principle with independent strain, which is free of shear locking. The cylindrical arc-length method is adopted to obtain a non-linear solution. The accuracy of the present analysis is demonstrated for benchmark problems. The effects of lamination angle, direction and location of patches are investigated on thermal post-buckling behavior under uniform and non-uniform temperature distributions. The thickness and lamination angle of the patch greatly affect the non-linear response of laminated patched panels. The present results show that the load-carrying capability can be improved by adding a reinforcing patch. The panel patched on the outside surface is more effective than that on the inside to improve the thermoelastic post-buckling behavior. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:137 / 145
页数:9
相关论文
共 50 条