High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply

被引：0

作者：

Palko, James W. ^{[1
]}

Lee, Hyoungsoon ^{[1
]}

Agonafer, Damena D. ^{[1
]}

Zhang, Chi ^{[1
]}

Jung, Ki Wook ^{[1
]}

Moss, Jess ^{[1
]}

Wilbur, Joshua D. ^{[1
]}

Dusseault, Tom J. ^{[1
]}

Barako, Michael T. ^{[1
]}

Houshmand, Farzad ^{[1
]}

Rong, Guoguang ^{[1
]}

Maitra, Tanmoy ^{[1
]}

Gorle, Catherine ^{[1
]}

Won, Yoonjin ^{[2
]}

Rockosi, Derrick ^{[3
]}

Mykyta, Ihor ^{[3
]}

Resler, Dan ^{[3
]}

Altman, David ^{[3
]}

Asheghi, Mehdi ^{[1
]}

Santiago, Juan G. ^{[1
]}

Goodson, Kenneth E. ^{[1
]}

机构：

[1] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA

[2] Univ Calif Irvine, Dept Mech & Aerosp Engn, Irvine, CA 92717 USA

[3] Raytheon Integrated Def Syst, Adv Technol Programs, Sudbury, MA USA

来源：

2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) | 2016年

关键词：

Two-phase cooling; high heat flux; diamond; porous copper; microfluidics; 3D manifold; boiling; evaporation; phase separation; THERMAL MANAGEMENT;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We here present an approach to cooling of electronics requiring dissipation of extreme heat fluxes exceeding 1 kW/cm(2) over similar to 1 cm(2) areas. The approach applies a combination of heat spreading using laser micromachined diamond heat sinks; evaporation/boiling in fine featured (5 mu m) conformal porous copper coatings; microfluidic liquid routing for uniform coolant supply over the surface of the heat sink; and phase separation to control distribution of liquid and vapor phases. We characterize the performance of these technologies independently and integrated into functional devices. We report two-phase heat transfer performance of diamond/porous copper heat sinks with microfluidic manifolding at full device scales (0.7 cm(2)) with heat fluxes exceeding 1300 W/cm(2) using water working fluid. We further show application of hydrophobic phase separation membranes for phase management with heat dissipation exceeding 450 W/cm(2) at the scale of a single extended surface (similar to 300 mu m).

引用

页码：1511 / 1517

页数：7

共 22 条

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